Product Overview
We produce overmoulded electronic module connectors on 320T and 800T rotary tables, so the hard substrate and the soft or second material are moulded in one cycle and the bond is formed in the tool rather than by a later gluing step.
The bond is the whole point of this process, so we design the joint, not just the part: mechanical interlock through holes and undercuts, substrate pre-treatment where the material pair needs it, and a gate and vent layout that does not trap gas at the bond line.
Material combinations
- TPE and TPU onto ABS, PC, PC/ABS, PA and PBT
- Two-shot rigid combinations such as PC/ABS with PMMA or ASA
- Metal inserts, terminals and stamped components overmoulded in place
- Silicone LSR where a higher temperature or medical grade is required
Joint design
- Mechanical interlock by through-holes, dovetails and undercuts
- Substrate pre-treatment and drying where the pair requires it
- Gate position and venting set to keep the bond line free of gas traps
- Pull and peel testing on the T1 samples to confirm the bond holds
Material is selected to your drawing. The grades listed are the ones we run most often for this type of part; we confirm the choice at DFM rather than assuming it.